September 5, 2013, Advanced Semiconductor Engineering Inc. (ASE) successfully closed its issuance of  USD 400 million zero coupon convertible bonds due 2018 overseas.

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test and a leading provider of a comprehensive range of advanced IC Packaging.

Jingtian & Gongcheng acted as the underwriter's PRC legal counsel.